View NSR10F40NXT5G_5011912.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

NSR10F40NXT5G Schottky Barrier Diode
These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current and are offered in a Chip Scale Package (CSP) to reduce board space. The low thermal resistance enables designers to meet the challenging task of achieving higher efficiency and meeting reduced space requirements.
Features
http://onsemi.com
* * * * * *
Very Low Forward Voltage Drop - 490 mV @ 1.0 A Low Reverse Current - 10 mA @ 10 V VR 1.0 A of Continuous Forward Current ESD Rating - Human Body Model: Class 3B ESD Rating - Machine Model: Class C Very High Switching Speed These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant LCD and Keypad Backlighting Camera Photo Flash Buck and Boost dc-dc Converters Reverse Voltage and Current Protection Clamping & Protection Mobile Handsets MP3 Players Digital Camera and Camcorders Notebook PCs & PDAs GPS
40 V SCHOTTKY BARRIER DIODE
1 CATHODE 2 ANODE
2
MARKING DIAGRAM
PIN 1
Typical Applications
* * * * * * * * * *
1 DSN2 (0502) CASE 152AD 10F40 YYY
10F40 YYY
Markets
= Specific Device Code = Year Code
ORDERING INFORMATION
Device NSR10F40NXT5G Package Shipping
DSN2 5000 / Tape & Reel (Pb-Free)
MAXIMUM RATINGS
Rating Reverse Voltage Forward Current (DC) Forward Surge Current (60 Hz @ 1 cycle) ESD Rating: Human Body Model Machine Model Symbol VR IF IFSM ESD Value 40 1.0 18 >8 > 400 Unit V A A kV V
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
(c) Semiconductor Components Industries, LLC, 2010
July, 2010 - Rev. 2
1
Publication Order Number: NSR10F40/D
NSR10F40NXT5G
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance Junction-to-Ambient (Note 1) Total Power Dissipation @ TA = 25C Thermal Resistance Junction-to-Ambient (Note 2) Total Power Dissipation @ TA = 25C Storage Temperature Range Junction Temperature Symbol RqJA PD RqJA PD Tstg TJ Min Typ Max 228 548 85 1.47 -40 to +125 +150 Unit C/W mW C/W W C C
1. Mounted onto a 4 in square FR-4 board 50 mm sq. 1 oz. Cu 0.06" thick single sided. Operating to steady state. 2. Mounted onto a 4 in square FR-4 board 1 in sq. 1 oz. Cu 0.06" thick single sided. Operating to steady state.
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic Reverse Leakage (VR = 10 V) (VR = 40 V) Forward Voltage (IF = 0.5 A) (IF = 1.0 A) Symbol IR Min Typ Max 10 100 0.42 0.49 Unit mA
VF
V
1 IF, FORWARD CURRENT (A) TJ = 125C 0.1 TJ = 150C
100000 IR, REVERSE CURRENT (mA) 10000 1000 100 10 1 0.1 0.01 0.001 0 5 10 15
150C 125C 75C
0.01
25C
0.001 0.0
75C 0.1
25C 0.2
-25C 0.3 0.4 0.5
-25C 20 25 30 35 40
VF, FORWARD VOLTAGE (V)
VR, REVERSE VOLTAGE (V)
Figure 1. Forward Voltage
200 180 C, CAPACITANCE (pF) 160 140 120 100 80 60 40 20 0 0 5 10 15 20 25 30
Figure 2. Typical Reverse Current
TA = 25C
35
40
VR, REVERSE VOLTAGE (V)
Figure 3. Typical Capacitance http://onsemi.com
2
NSR10F40NXT5G
PACKAGE DIMENSIONS
DSN2, 1.4x0.6, 0.75P CASE 152AD-01 ISSUE A
0.05 C D AB E TOP VIEW 0.05 C A 0.05 C A1 SIDE VIEW C
SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. DIM A A1 b D E L L2 L3 MILLIMETERS MIN MAX 0.25 0.31 --- 0.05 0.45 0.55 1.40 BSC 0.60 BSC 1.20 1.30 0.70 0.80 0.20 0.30
0.05 C
CATHODE BAND MONTH CODING
DEC NOV OCT
0.05 C A B L L/2
1
SEP JUN MAR FEB JAN
b 0.05 C A B L2
XXXX YYY XXXX Y09
INDICATES AUG 2009
DEVICE CODE YEAR CODE
L3 BOTTOM VIEW
(EXAMPLE)
MOUNTING FOOTPRINT*
1.55 0.47 PIN 1 0.60 0.95
DIMENSIONS: MILLIMETERS
See Application Note AND8398/D for more mounting details *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
http://onsemi.com
3
NSR10F40/D

▲Up To Search▲

Price & Availability of NSR10F40NXT5G

	To Download NSR10F40NXT5G Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .